have been localized by GCT Semiconductor, a local (Korean)
company with its headquarters in Silicon Valley in the US.
Through a technological alliance with UMC in Taiwan, the world's
2nd largest semiconductor foundry, GCT became only the third
company in the world to develop Bluetooth chips based upon
Through continuous testing and characterization work over
the last 2 years, GCT has succeeded in developing Bluetooth
chips using the 0.25зн RF CMOS (complementary metal oxide semiconductor)
process of UMC, according to a company spokesman.
Characterized by low production costs and power consumption,
RF CMOS processing adds the benefits of digital and analog
device processing, unlike the analog device processing of
ordinary CMOS techniques.
Before, RF CMOS process could not be widely used, due to its
complexity and instability. But GCT succeeded in developing
the new technology through close technological ties with UMC
and by conducting numerous tests.
"By forming our technological alliance with UMC, we achieved
the optimal combination of design and process technologies.
This will allow us to strengthen our design leadership in
advanced LAN markets. We will adopt this process not only
for Bluetooth but also for CDMA (Code Division Multiple Access)
telecommunications systems," says president Lee Ki-Sub.