GCT Semiconductor Develops Bluetooth Chips on RFCMOS Process

April 12, 2001 IT Daily - A domestic semiconductor company with

its headquarters in Silicon Valley, GCT Semiconductor Inc. announced on April 11 that it has developed Bluetooth-enabled chips using the 0.25зн RFCMOS process pioneered by UMC of Taiwan (the firm's technological partner and the world's second largest independent semiconductor foundry). Taking advantage of this achievement, the company plans to adopt UMC's standard RF CMOS process to develop not only Bluetooth and PLL IC's for IS-95C applications, but also IC's for W-CDMA systems.

Compared with ordinary complementary metal oxide semiconductor (CMOS), which consists of digital and analog device processes, RFCMOS has an additional function in analog device processing. It is a key technology for achieving RF functionality and will greatly contribute to reducing power consumption.

Says GCT president Lee Ki-Sub: "With help from UMC, we successfully developed RFCMOS chip sets, which demonstrates the accuracy of UMC processing. We plan to use this alliance with UMC to take the technological lead in the advanced wireless LAN market."

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