an IC specifically designed for Bluetooth applications. The
chip is based on GCT's direct conversion RF design and is
intended to provide OEMs with a viable RF CMOS platform.
A release by GCT integrates the RF function and the modem
capabilities on one CMOS chip, named the GDM1100. The radio
portion of the chip is the result of GCT's proprietary architecture
that uses a direct conversion scheme that is designed to provide
Santa Clara, Calif.-based GCT claims the GDM1100 is also capable
of frequency hopping around 2.4GHz and is capable of delivering
data rates of 1Mbit per second. The antenna sensitivity allows
the chip to transmit to ranges of 30 feet. The company also
claims the chip has low power consumption of 2.7V and a 60dB
receiver dynamic range. Industry analysts estimate that the
Bluetooth market will grow to $3 billion by 2005.
Because Bluetooth technology eliminates the need to wire devices,
GCT sees tremendous growth opportunity for its RF-based Bluetooth
products that can be used in wireless telephones, PCs, consumer
electronics, home networks, "smart appliances" and
other wireless environments, such as personal area networks
(PANs) and more traditional local area networks (LANs).
Despite its small footprint, the GDM1100 integrates onto one
CMOS chip both RF front-end and modem capabilities, the company
said. The radio IC portion employs a direct conversion scheme,
which makes for "unparalleled" channel selectivity,
the company claims.
"With more advanced chip designs on the horizon, launching
the GDM1100 Bluetooth solution was a relatively easy way for
GCT to quickly grab and begin establishing long-term OEM customers,"
said K.S. Lee, CEO of GTC, in a statement.
About GCT Semiconductor, Inc.
GCT Semiconductor is a fabless semiconductor company that
designs, develops and markets innovative integrated circuit
solutions for the wireless communications industry. The company's
patented direct conversion architecture, which is the basis
for GCT's radio frequency (RF) core, can efficiently support
multimode applications and be fabricated on standard CMOS
processes. Its initial products are PLL's, 2 chip Bluetooth
chipsets, a 1 chip Bluetooth IC, and a future 802.11b/g radio.
The company headquarters are located at 2121 Ringwood Ave,
San Jose, CA 95131.