GCT to describe design breakthroughs during three
presentations in Kyoto, Japan

Kyoto, Japan - June 14, 2001 - GCT Semiconductor, Inc. (GCT) today announced it will be presenting three technical papers detailing the company's RF chipsets technologies covering wideband CDMA, Bluetooth, and CDMA RF PLL at this year's 2001 Symposium on VLSI circuits (SOVC) in Kyoto, Japan. Chosen for their originality and informative quality, the advanced content of the three papers presented by three GCT engineers, will not be publicly announced or published prior to the symposium.

The symposium provides those involved in the design of integrated circuits an opportunity to observe and present important new work and technologies at an international forum. GCT's three presentations will cover a broad spectrum of its current technologies, but will focus on wideband CDMA CMOS direct conversion transmitter and receiver, single-chip 2.4GHz direct conversion CMOS transceiver with GFSK modem, and CDMA RF PLL technology. Sponsored by IEEE Solid-State Circuits Society and the Japan Society of Applied Physics, the symposium with focus on circuit design and will partially overlap with the Symposium on VLSI Technology.

"Having the opportunity to present at SOVC is a strong indicator that GCT's advanced CMOS direct conversion RF technology has been widely admitted by academic society," said K.S. Lee, GCT's president and CEO. "We are enthusiastic to share our advanced technologies in such a respected forum as SOVC and look forward to highlighting the advantages of a technology that will deliver cost-effective multi-mode RF solutions for various emerging wireless standards."

Using its CMOS direct conversion technology, GCT plans to deliver Bluetooth, WCDMA, 802.11a RF products and various multi-mode RF front-end solutions such as dual mode RF for 802.11a/802.11b and GPRS/WCDMA. GCT's RF PLL technology, a technology targeting the 2nd generation handset market including GSM and IS-95C, is expected to deliver substantial revenue for the company in the coming months.

The design and manufacturing advances developed at GCT allow the company to demonstrate direct conversion RF on standard CMOS-paving the way for future inexpensive new transmitter/receiver chipsets for WCDMA and highly integrated CMOS PLL circuits with on-chip VCO for CDMA and GSM wireless standards.

About GCT Semiconductor, Inc.

GCT Semiconductor is a leading supplier of integrated CMOS solutions for the Wireless Communication Industry. The company uses advanced design methodologies that have allowed the company to develop cost-effective chipsets that are manufactured on standard CMOS processes. GCT's unique ability to use standard manufacturing processes and yet achieve high performance standards for cellular, local and personal area wireless networks has resulted in new direct conversion RF and advanced PLL circuits ideal for a variety of wireless communication applications. The company provides innovative chipsets in support of Bluetooth and all major cellular protocols including the third generation (3G) standard. The company's Web site can be found at http://www.gctsemi.com.

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