Monte Carlo - June 5, 2001 - GCT Semiconductor, Inc.
(GCT) today announced it will be demonstrating a Bluetooth
piconet at the International Bluetooth Congress 2001 (Booth
G1) using its Bluetooth GDM1100 Radio and GDM1101b chipset.
The demo will highlight GCT's direct conversion CMOS Bluetooth
solution, configured in a piconet with three laptops. Besides
available samples, GCT also offers a comprehensive GCT Bluetooth
Development Kit (GBDK) for prospective customers to speed
the system design process.
In GCT's piconet demo, each laptop will be configured with
a GCT Bluetooth sample kit in a host configuration via the
Host Controller Interface (HCI). This configuration allows
each laptop to run its "bouncing ball" software
over the upper level Bluetooth software stack, which controls
the GCT Bluetooth Baseband and Radio ICs with HCI commands
via a serial link. One of the three laptops will operate as
the master of the piconet while the other two laptops will
operate as slaves-sharing information about the location of
the "bouncing ball" while perfectly synchronizing
the timing and location of the ball as it jumps from one screen
to the next. Along with the "bouncing ball" demonstration,
the demo will include LAN access point (LAP) and file transfer
demonstration through the piconet configuration.
"This is the first time that we've shown a Bluetooth
piconet demo with our GDM1100/1101b chipset, supporting a
total solution from the radio and baseband ICs to the Bluetooth
software stack," said Dr. K.H. Lee, CTO and founder of
GCT. "We are excited about demonstrating our complete
direct conversion CMOS technology, which lowers the cost basis
for Bluetooth implementations, as well as other GCT RF solutions
for 802.11a/b and WCDMA. GCT's CMOS direct conversion technology
will deliver cost-effective multi-mode RF solutions for various
emerging wireless standards."
With the continued emergence of a wireless, multi-media market,
GCT's mature DSP core and multi-media technology will enable
future RF solutions for cost-effective SoC (system-on-chip)
multi-media applications. Its GDM1100 Bluetooth Radio IC is
a direct conversion CMOS transceiver with a GFSK modem designed
to work with the GDM1101b Bluetooth Baseband IC-a CMOS Bluetooth
baseband IC running the necessary Bluetooth software to support
multiple connections for a Bluetooth piconet.
"Bluetooth Congress 2001 is an ideal platform for us
to demonstrate the technological milestones GCT has reached
to develop the high-performance, cost-effective chips needed
to make true wireless networking a reality," said K.S.
Lee, GCT's president and CEO. "We are proud not only
to demonstrate to visitors the success of our point-to-multi-point
Bluetooth communication using GCT's Bluetooth chipset solutions,
but also to be the main sponsor of the 'Chill-Out Zone,' a
hospitality suite for conference attendees. We hope our visitors
will come away not only a little more relaxed, but also with
a better understanding about GCT and its next-generation wireless
The design and manufacturing advances developed at GCT allow
the company to demonstrate direct conversion RF on standard
CMOS-paving the way for future inexpensive new transmitter/receiver
chipsets for WCDMA and highly integrated CMOS PLL circuits
with on-chip VCO for CDMA and GSM wireless standards.
GCT will continue to demonstrate the unique breadth of its
technology at the Symposium on VLSI circuits (SOVC) in Kyoto,
Japan this coming June. GCT will be presenting several papers
at the symposium detailing its RF chipsets technologies-further
evidence that its CMOS direct conversion RF technology has
been widely admitted by academic society.
About GCT Semiconductor, Inc.
GCT Semiconductor is a leading supplier of integrated CMOS
solutions for the Wireless Communication Industry. The company
uses advanced design methodologies that have allowed the company
to develop cost-effective chipsets that are manufactured on
standard CMOS processes. GCT's unique ability to use standard
manufacturing processes and yet achieve high performance standards
for cellular, local and personal area wireless networks has
resulted in new direct conversion RF and advanced PLL circuits
ideal for a variety of wireless communication applications.
The company provides innovative chipsets in support of Bluetooth
and all major cellular protocols including the third generation
(3G) standard. The company's Web site can be found at http://www.gctsemi.com.