Santa Clara, CA - April 9, 2001 - GCT Semiconductor
today announced the successful implementation of Bluetooth
standards using UMC's quarter micron RFCMOS process. Testing
and characterization efforts at GCT have confirmed that UMC
has successfully manufactured prototypes of GCT's RFCMOS Bluetooth
chipset. The proprietary design techniques developed at GCT
will allow the company to take advantage of standard RF CMOS
manufacturing capabilities to implement new wireless components
for Bluetooth, Wide-band Code Division Multiple Access (W-CDMA)
and IS-95C systems.
"This manufacturing partnership with UMC has provided
an excellent demonstration of the power of innovative design
techniques when combined with state-of-the-art manufacturing
strengths," said Mr. Kisub Lee, president and CEO of
GCT Semiconductor, Inc. "We decided to use UMC because
of its reputation as the foundry industry technology leader.
The ease with which we were able to manufacture our RFCMOS
Bluetooth chipset is testimony to the fidelity of UMC's process
GCT demonstrated the success of its Bluetooth chipset at the
CeBIT Exhibition in Hannover, Germany, March 22-28. The GDM1100,
Bluetooth Radio Chip lowers system cost and board space by
integrating external components and improves performance with
superior channel selectivity and image-free operations that
meet strict requirements for adjacent channel power rejection
(ACPR). The companion GDM1101b Bluetooth baseband IC implements
generic access profiling. The on-chip 32-bit RISC microcontroller
embedded in the GDM1101b is powerful enough to support full-featured
Bluetooth communications. With products currently available
for engineering evaluation, the GDM1100 and GDM1101b, along
with an external flash memory, provide a complete Bluetooth
solution, including a fully compliant Bluetooth software protocol
"As a world renowned foundry with industry leading process
technologies for RFCMOS manufacturing, UMC is sensitive to
the needs of the wireless communications market," said
Jim Ballingall, vice president of worldwide marketing at UMC.
"UMC is proud to participate in the proliferation of
the wireless communications boom by partnering with a design
house as strong as GCT Semiconductor."
By taking advantage of the UMC manufacturing process, GCT
has paved the way for affordable implementation of the Bluetooth
radio standards. The ability to accomplish Direct Conversion
RF on CMOS has overcome several of the obstacles faced when
implementing a cost-effective wireless LAN capability.
About GCT Semiconductor, Inc.
GCT Semiconductor is a leading supplier of integrated CMOS
chipset solutions for the Wireless Communications Industry.
The company utilizes advanced design methodologies that have
allowed the company to develop cost-effective chipsets that
are manufactured on standard CMOS processes. GCT's unique
ability to use standard manufacturing processes and yet achieve
high performance standards for cellular, local and personal
area wireless networks have resulted in new Direct Conversion
RF and advanced PLL circuits ideal for a variety of wireless
communication applications. The company provides innovative
chipsets in support of Bluetooth and all major cellular protocols
including the third generation (3G) standard. The company
headquarters are located at 2121 Ringwood Ave, San Jose, CA
Please visit us at http://www.gctsemi.com