CeBIT, Hannover, Germany - March 22, 2001 - Today
GCT Semiconductor, Inc. of Santa Clara, CA will demonstrate
new products that take advantage of GCT's advanced Direct
Conversion RF on standard CMOS technology. Using proprietary
design techniques, the company has developed integrated communications
products that dramatically reduce the cost of implementing
wireless protocols for Bluetooth, WCDMA, and IS-95C standards
by using a standard CMOS process. The suite of products will
be demonstrated at Booth A24d, in Hall 24 of the CeBIT exhibition.
Dr. Kyeongho Lee, Founder and CTO, will present a paper entitled
"Fully integrated CMOS RF solutions for Wireless LAN
and WCDMA: Meaning, Experience, Solutions and Trends"
at 17:00 (5:00 pm) in the Saal Frankfurt session. Dr. Lee's
presentation will outline the techniques and capabilities
that have allowed GCT Semiconductor to assume a leadership
role in wireless communications.
The company will demonstrate point-to-point Bluetooth communication
using the GDM1100 and GDM1101b Bluetooth chipset solutions.
GDM1100 is a Bluetooth radio transceiver IC with a GFSK modem.
GDM1101b is a Bluetooth baseband IC for generic access profile
implementation. Together, the GDM1100 and GDM1101b, along
with an external flash memory, provide a complete Bluetooth
solution, including a fully-compliant Bluetooth software protocol
stack. GDM1100 and GDM1101b are implemented with a 0.25um
CMOS process that lowers system cost and reduces board space
by integrating external components and by improving performance
with superior channel selectivity and image-free operations
that meet strict requirements for adjacent channel power rejection
(ACPR). The on-chip 32-bit RISC microcontroller embedded in
the GDM1101b is powerful enough to support full-featured Bluetooth
communications. With products currently available for engineering
evaluation, GCT also offers a comprehensive software development
kit (SDK) to speed the system design process. The demonstration
will take place at Booth A24d, in Hall 24 of the CeBIT exhibition.
"CeBIT is the ideal place for GCT to unveil the methodologies
that have allowed us to develop the high-performance, cost-effective
chips needed to make true wireless networking a reality,"
said Dr. Lee. "Using the techniques outlined in our presentation
and demonstrated with the GDM1100 and GDM1101b in our booth,
GCT is prepared to unveil several products in the coming weeks
for various data and voice wireless networking protocols."
The design and manufacturing advances developed at GCT allow
the company to demonstrate Direct Conversion RF on standard
CMOS, which paves the way for the introduction of inexpensive
new transmitter/receiver chipsets for WCDMA and highly integrated
CMOS PLL circuits with on-chip VCO for the CDMA and GSM wireless
standards. At the CeBIT Exhibition, GCT will demonstrate a
CMOS PLL solution with on-chip VCO targeting the IS-95C CDMA
About GCT Semiconductor, Inc.
GCT Semiconductor is a leading supplier of integrated CMOS
solutions for the Wireless Communication Industry. The company
uses advanced design methodologies that have allowed the company
to develop cost-effective chipsets that are manufactured on
standard CMOS processes. GCT's unique ability to use standard
manufacturing processes and yet achieve high performance standards
for cellular, local and personal area wireless networks has
resulted in new Direct Conversion RF and advanced PLL circuits
ideal for a variety of wireless communication applications.
The company provides innovative chipsets in support of Bluetooth
and all major cellular protocols including the third generation
(3G) standard. The company headquarters are located at 3016
Scott Blvd, Santa Clara, CA 95054.
Please visit us at http://www.gctsemi.com