GCT SEMICONDUCTOR DEMONSTRATES A SUITE OF HIGH PERFORMANCE SOLUTIONS FOR BLUETOOTH, WCDMA AND IS-95C AT CeBIT EXHIBITION
GCT demonstrates CMOS solutions that enable the cost-effective implementation of Bluetooth and 2.5G/3G cellular technology

CeBIT, Hannover, Germany - March 22, 2001 - Today GCT Semiconductor, Inc. of Santa Clara, CA will demonstrate new products that take advantage of GCT's advanced Direct Conversion RF on standard CMOS technology. Using proprietary design techniques, the company has developed integrated communications products that dramatically reduce the cost of implementing wireless protocols for Bluetooth, WCDMA, and IS-95C standards by using a standard CMOS process. The suite of products will be demonstrated at Booth A24d, in Hall 24 of the CeBIT exhibition. Dr. Kyeongho Lee, Founder and CTO, will present a paper entitled "Fully integrated CMOS RF solutions for Wireless LAN and WCDMA: Meaning, Experience, Solutions and Trends" at 17:00 (5:00 pm) in the Saal Frankfurt session. Dr. Lee's presentation will outline the techniques and capabilities that have allowed GCT Semiconductor to assume a leadership role in wireless communications.

The company will demonstrate point-to-point Bluetooth communication using the GDM1100 and GDM1101b Bluetooth chipset solutions. GDM1100 is a Bluetooth radio transceiver IC with a GFSK modem. GDM1101b is a Bluetooth baseband IC for generic access profile implementation. Together, the GDM1100 and GDM1101b, along with an external flash memory, provide a complete Bluetooth solution, including a fully-compliant Bluetooth software protocol stack. GDM1100 and GDM1101b are implemented with a 0.25um CMOS process that lowers system cost and reduces board space by integrating external components and by improving performance with superior channel selectivity and image-free operations that meet strict requirements for adjacent channel power rejection (ACPR). The on-chip 32-bit RISC microcontroller embedded in the GDM1101b is powerful enough to support full-featured Bluetooth communications. With products currently available for engineering evaluation, GCT also offers a comprehensive software development kit (SDK) to speed the system design process. The demonstration will take place at Booth A24d, in Hall 24 of the CeBIT exhibition.

"CeBIT is the ideal place for GCT to unveil the methodologies that have allowed us to develop the high-performance, cost-effective chips needed to make true wireless networking a reality," said Dr. Lee. "Using the techniques outlined in our presentation and demonstrated with the GDM1100 and GDM1101b in our booth, GCT is prepared to unveil several products in the coming weeks for various data and voice wireless networking protocols."

The design and manufacturing advances developed at GCT allow the company to demonstrate Direct Conversion RF on standard CMOS, which paves the way for the introduction of inexpensive new transmitter/receiver chipsets for WCDMA and highly integrated CMOS PLL circuits with on-chip VCO for the CDMA and GSM wireless standards. At the CeBIT Exhibition, GCT will demonstrate a CMOS PLL solution with on-chip VCO targeting the IS-95C CDMA standard.

About GCT Semiconductor, Inc.

GCT Semiconductor is a leading supplier of integrated CMOS solutions for the Wireless Communication Industry. The company uses advanced design methodologies that have allowed the company to develop cost-effective chipsets that are manufactured on standard CMOS processes. GCT's unique ability to use standard manufacturing processes and yet achieve high performance standards for cellular, local and personal area wireless networks has resulted in new Direct Conversion RF and advanced PLL circuits ideal for a variety of wireless communication applications. The company provides innovative chipsets in support of Bluetooth and all major cellular protocols including the third generation (3G) standard. The company headquarters are located at 3016 Scott Blvd, Santa Clara, CA 95054.
Please visit us at http://www.gctsemi.com

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